Process Development Engineer

SUMMARY The microfabrication process engineer is a key resource on the MicroConnex engineering team and is responsible for unit process development and manufacturing support.
This position will focus on the circuit board plating process such as Ni/Au and Cu plating, Cu etching, surface preparation and management of our water processes including deionized water generation.
Significant opportunities exist for engineers to automate various aspects of the process.
Additional responsibility includes oversight of hazardous material, waste management/treatment and other compliance activities.
The successful candidate will be a motivated self-starter with a desire to improve both the technical and social systems necessary for optimal performance and will hold experience from mid-career level to experienced professional.
Total compensation will be competitive and depends on experience.
ESSENTIAL JOB FUNCTIONS Provide technical leadership in wet plating/etching process modules for development of processes in support of manufacturing.
Use technical roadmaps and risk analysis to target processes for performance improvement.
Lead cross functional yield improvements projects across adjacent unit processes.
Characterize operational space, measurement systems, automation, feedback loops, recipe control, maintenance, and other documentation to ensure processes remain in control.
Develop capital equipment requirements, create specifications for new equipment, evaluate vendors/suppliers, make procurement recommendations, and manage equipment install and qualification.
Contribute to daily SQDC (Safety, Quality, Delivery, and Cost) targets for wet process modules.
Partner with manufacturing staff to ensure usable process instructions and training articles are effective in manufacturing.
Support and champion company policies and procedures used in our quality management, environmental management, health and safety systems and other standards to ensure we treat our people and environment with the upmost of care.
*Other duties may be assigned* PHYSICAL DEMANDS The physical demands described here are representative of those that must be met by an employee to successfully perform the essential functions of this job.
Reasonable accommodations may be made to enable individuals with disabilities to perform the essential functions.
While performing the duties of this job, the employee is regularly required to use hands to finger, handle or feel, and talk or hear.
The employee frequently is required to reach with hands and arms.
The employee is required to stand and walk.
The employee must occasionally lift walk.
The employee must occasionally lift and/or move up to 25 pounds.
Specific vision abilities required by this job include close vision, distance vision, color vision, peripheral vision, depth perception, and ability to adjust focus WORK ENVIRONMENT Carlisle Interconnect Technologies is a clean facility, housing different machinery, equipment, processes, andchemicals which produce potential hazards in the work environment such as: ergonomic, chemical, machine pointof operation and powered industrial vehicle traffic.
These hazards are controlled through means of engineering controls, such as machine guarding, and administrative controls, such as safety policies and programs ENVIRONMENTAL POLICY Carlisle Interconnect Technologies is dedicated to identifying and reducing the environmental impact of its operations, activities, and products.
It is our commitment to comply with all applicable laws and other regulatory requirements concerning the environment.
We are committed to preventing pollution and continually improving our environmental performance in all of our global operations.
This will be achieved through a comprehensive Environmental Management System that provides the framework for setting and reviewing environmental objectives and targets of Carlisle Interconnect Technologies EXPORT COMPLIANCE DISCLAIMER This position includes accessorpotential access to ITAR and/or EAR technical data.
Therefore, candidates will need to qualify as a US Person which is defined as a US Citizen, or a Permanent Resident (Green Card Holder).
Travel 10% - 15% Salary In compliance with multiple state's wage transparency laws, the hourly salary for this position will be $91,000 - $114,000.
Please note that the salary information is a general guideline only.
Carlisle Interconnect Technology reviews factors such as but not limited to responsibilities of the position, scope of work, candidate's work experience, education/training, key skills, internal pay equity, as well as market considerations when extending an offer.
Engineer II: $91,000 - $105,000 Engineer III: $105,000 - $114,000 Requirements: Qualifications Excellent written and oral communication skills with demonstrated ability to effectively communicate technical information to both subject and non-subject matter experts.
Ability to work independently and cross-functionally to meet company and departmental objectives.
Results and documentation-oriented work philosophy with high attention to detail and desire to grow.
Skilled in root cause analysis using structured problem solving tools and approaches (e.
g.
, 8D or DMAIC, fishbone diagrams, Five Why's, etc.
).
Skilled in multi-factor experimental design and execution using both test vehicles and production lots.
Hands on experience using process data, interpretation with statistical tools such as Minitab or JMP.
Experience with application of statistical process control (SPC) in a manufacturing environment.
Effective using basic project management tools.
Experience in specification of equipment, vendor evaluation, procurement recommendation and equipment qualification; working knowledge of DQ/IQ/OQ/PQ process is a plus.
Special consideration will be given to candidates with experience developing and/or supporting any of the following microfabrication processes: Electrodeposition of common conductor materials including copper, nickel, and gold Thin film deposition of metals, metal alloys, oxides and/or dielectrics via vacuum processes including sputter, CVD, PECVD, evaporation or ALD Wet or dry (plasma) chemical etching of metals and/or dielectrics Laser ablation for micromachining polymeric, metal, ceramic or similar substrates Substrate cleaning processes including common wet cleans and plasma cleans Lamination or bonding of microelectronic packages or sub-assemblies Administering waste water compliance, permits, treatment systems and reporting Administering solid waste compliance per agency EPA, DOE, DOT requirements.
Education BS in chemical engineering or materials science, MS or PhD preferred.
Applicants with degrees in other engineering disciplines, physics and/or chemistry will be considered with sufficient relevant industrial experience.
Experience (Required) Engineer II: 3+ years in printed circuit fabrication shop (flex or rigid) or 2+ years in MEMs, printed/plastic electronics or IC fabrication environment (working in a clean room a plus) with direct experience developing and/or supporting thin film microfabrication manufacturing processes at development or production scale.
Experience (Preferred) Engineer III: 5+ years in printed circuit fabrication shop (flex or rigid) or 5+ years in MEMs printed/plastic electronics or IC fabrication environment (working in a clean room a plus) with direct experience developing and/or supporting thin film microfabrication manufacturing processes at development or production scale.
Experience as both fab process engineer and fab integration engineer a plus.